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Technical Bulletins

Number: 95-0619B (Heat Transfer Device)

Product Name:

Die Cut Thermally Conductive Pad

Description:

This die cut part is a thermally conductive adhesive pad. The pad transfers heat from a microprocessor or other semiconductor component to a heat sink. It also serves to attach the two parts together. The component has a designed in tab for ease of installation. The tab removes a protective cover that exposes the adhesive.

Application:

Microprocessor. Also, many other applications where a semiconductor component requires attachment to a heat sink in lieu of mechanical fasteners.

Material Used:

Aluminum oxide filled acrylic adhesive coated onto a .002" thick aluminum foil with easy release film protector.

Other Materials:

Titanium Diboride filled with acrylic adhesive applied to expanded aluminum.

Tolerances:

± .010"

Production Rates:

Over 300,000 pieces per month with existing steel rule die tooling.